Jeremy Pasatta, CVC R&D Chemist, presented a paper titled “Improved Low Temperature Performance of Epoxy Adhesives” at the Thermoset Resin Formulators Association (TRFA) 7th Annual Meeting. Held from September 13-15, 2009 in Pittsburgh, PA, this was the industry's premier event for members of the TRFA, as well as thermoset resin industry suppliers and formulators to showcase new technologies. This study examined a novel method for combining both CTB and CTBN in the synthesis of an epoxy terminated butadiene acrylonitrile (ETBN) copolymer, thus providing both solubility in the initial pre-cured epoxy resin as well as excellent low temperature performance in the cured adhesive.
Epoxy adhesives are extremely brittle, and require a method of toughening for use in structural adhesives. Traditional methods for toughening epoxy resins, such as the incorporation of carboxyl terminated butadiene acrylonitrile (CTBN) copolymers, give good room and elevated temperature toughening, but does not improve low temperature performance, while the incorporation of carboxyl terminated butadiene (CTB) homopolymer will give improved low temperature properties but will phase separate from the pre-cured epoxy resin. A novel method for combining both CTB and CTBN in the synthesis of an epoxy terminated butadiene acrylonitrile (ETBN) copolymer thus providing both solubility in the initial pre-cured epoxy resin as well as excellent low temperature performance in the cured adhesive was presented. Link to paper presented at the 2009 TRFA.
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